Camera Module: Tips to Choose & Manufacturing Processes

Since the camera module plays an increasingly important role in electronic products, let’s learn more about it so that you can make right decisions concerning camera module of your products.

We’re going to provide some tips and the manufacturing process of camera module in the following content. Hope it helps.

How to choose a proper camera module

  • Early in the design phase, you have to consider and determine the pixel, the size and the type of camera module. Because for certain product,  it’s close to impossible to change once these parameters are decided,
  • Check if the camera module you select is compatible with the platform, or more precisely, the SOC (system on chip) which the certain device is using.
  • Determine the imaging direction on the basis of the structure and placement of the camera module. The software can adjust a 180° imaging direction while it can’t do the 90° one.
Camera module on phone main board

2 different ways to pack the sensor

Before we get down to the manufacturing process of a camera module, it’s important that we get how the sensor is packed clear. Because the way of packaging affects the manufacturing process.

Sensor is a key component in the camera module.

In the manufacturing process of a camera module, there are two ways to pack the sensor: chip scale package (CSP) and chip on board (COB).

Chip scale package (CSP)

CSP means the package of the sensor chip has an area no greater than 1.2 times that of the chip itself. It’s done by the sensor manufacturer, and usually there is a layer of glass covering the chip.

Chip on board (COB)

COB means the sensor chip will be directly bonded to PCB (printed circuit board) or FPC (flexible printed circuit). COB process is part of the camera module production process, thus it’s done by the camera module manufacturer.

Comparing the two packaging options, CSP process is faster, more accurate, more expensive, and may cause poor light transmittance, while COB is more space-saving, cheaper, but the process is longer, the yield problem is larger, and can’t be repaired.


Manufacturing process of a camera module

For camera module using CSP:

1. SMT (surface mount technology): first prepare the FPC, then attach the CSP to FPC. It’s usually done in a large scale.

2. Cleaning and segmentation: clean the large circuit board then cut it into standard pieces.

3. VCM (voice coil motor) assembly: assemble the VCM to the holder using glue, then baker the module. Solder the pin.

4. Lens assembly: assemble the lens to the holder using glue, then bake the module.

5. Whole module assembly: attach the lens module to circuit board through ACF (anisotropic conductive film) bonding machine.

6. Lens inspection and focusing.

7. QC inspection and packaging.


For camera module using COB:

1. SMT: prepare the FPC.

2. Conduct COB process:

  • Die bonding: bond the sensor chip onto FPC.
  • Wire bonding: bond extra wire to fix the sensor.

3. Continue to VCM assembly and the rest of the procedures are the same as the CSP module.


This is the end of this post. If you want to know more about camera module, just leave your comment below or contact us. We’re glad to hear from you!

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